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A Silicon interposer with through silicon via (TSV) has become important key components of 3D integration. It is used as an intermediate carrier and a wiring device for IC components like logics, memories, sensors, and so on. Due to wiring with custom design on front and back side, a TSV interposer enables to adapt the fine pitch IO terminals of the mounted ICs to the IO geometries of the package...
A Silicon interposer with through silicon via (TSV) has become important key components of 3D integration. It is used as an intermediate carrier and a wiring device for IC components like logics, memories, sensors, and so on. Due to wiring with custom design on front and back side, a TSV interposer enables to adapt the fine pitch IO terminals of the mounted ICs to the IO geometries of the package...
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