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This paper describes the demonstration of 10-$\mu $ m diameter interlayer vias with 3.5-$\mu $ m wide re-distribution layer copper wiring in a unique dry-film polymer dielectric, ZEONIF ZS100 (ZS100), suitable for panel-based high-density organic and glass interposers. The uniqueness of polymer dielectric includes low dielectric constant, low dielectric loss, low moisture uptake, and low surface...
This paper describes the first demonstration of 10 μm diameter interlayer vias in low-moisture uptake and low surface-roughness dry film polymer dielectric for multi-layered re-distribution layer (RDL) structures to achieve 50 um bump pitch in high density organic and glass interposers. A new series of polymer dry films, ZS-100, at 10 um thickness were deposited on thin and low CTE organic or glass...
Interposer technology is becoming important to interconnect ultra-high performance ICs with ultra-high density I/Os. Silicon interposers fabricated by back-end of line (BEOL) wafer processes address these wiring density requirements, but are limited by their high cost and by their high electrical losses. Organic interposers have limitations too. Their limitations are due to their poor dimensional...
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