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Ultrathin 3-D glass interposers with through-package vias at the same pitch as through-silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3-D stacking of logic and memory devices. Such 3-D interposers provide wide-I/O channels for high signal bandwidth (BW) between the logic device on one side of the interposer and memory stack on the other side, without the...
2.5D integration based on interposer technologies provides high density integration and high system bandwidth. Among many materials for the interposer substrate, glass could be a promising material since it provides low signal loss and its ultra-thin thickness. When chips are stacked on the glass interposer, power distribution network impedance of 2.5D IC must be estimated, analyzed and optimized...
Double-sided 3D glass interposers and packages, with through package vias (TPV) at the same pitch as TSVs in Si, have been proposed to achieve high bandwidth between logic and memory with benefits in cost, process complexity, testability and thermal over 3D IC stacks with TSV. However, such a 3D interposer introduces power distribution network (PDN) challenges due to increased power delivery path...
This paper presents a new active and passive integration concept called 3D IPAC (Integrated Actives and Passives) to address the power integrity in high-performance and multifunctional systems. The 3D IPAC consists of an ultra-thin glass module with through-vias and double-side integration of ultra-thin active and passive components to form functional modules. By integrating power ICs, storage capacitors...
This paper demonstrates a novel low-cost thinfilm capacitor technology on silicon and glass interposers for decoupling in high-speed digital systems. Silicon interposers with thinfilm capacitors have been demonstrated before, but these technologies have not been widely adapted because of the high cost of platinum electrodes and their incompatibility with packaging infrastructure. Thinfilm capacitors...
System integration by die-embedding within electronic packages offers significant advantages in miniaturization, cost and performance for mobile devices. This paper presents the functional design and analysis of ultra-thin packages that combine embedded actives (GaAs Power Amplifier and a baseband digital IC) with embedded passives (band-pass filters), leading to an ultra-miniaturized WLAN sub-system...
Achieving high capacitance densities with capacitors integrated in thin film form has been a major challenge for the past few decades. Nanocapacitors utilizing nanostructured electrodes and conformal nanodielectrics provide unique opportunities to enhance capacitance volumetric efficiency by 5–10X compared to the state-of-the-art tantalum capacitors. This paper reports the first proof-of-concept demonstration...
This paper presents the integration of WLAN (2.4 and 5GHz) bandpass filters in glass interposer using through-package vias. The filters include novel embedded passive components such as stitched capacitors with reduced shunt parasitics and via-based inductors that provide area reduction. The filters designed for 2.4 GHz showed an insertion loss of less than 2dB and better than 15dB return loss, while...
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