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The mechanical behavior of lead free solders is highly dependent on the testing temperature. Previous investigations on mechanical characterization of conventional and doped lead free SAC solders have mainly emphasized stress-strain and creep testing at temperatures from 25 to 125 °C. However, solders are exposed to very high temperatures from 125–200 °C in several harsh environment applications including...
Due to aging phenomena, the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal and/or thermal cycling environments. In our ongoing studies, we are exploring aging phenomena by nano-mechanical testing of SAC lead free solder joints extracted from PBGA assemblies. Using nanoindentation techniques,...
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during elevated temperature aging were unexpectedly large and universally...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that large degradations occur in the material properties (stiffness and strength) and creep behavior of Sn-Ag-Cu (SAC) lead free solders...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that large degradations occur in the material properties (stiffness and strength) and creep behavior of Sn-Ag-Cu (SAC) lead free solders...
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