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Soft Solder die attach process has been used for more than 20 years. The conventional method evolved from the normal dot dispensing, soft solder dispenser (SSD) [1], Motorized Pre-Press Module (MPPM) to Programmable Pre-Press Module (PPPM) [2] and multi dot dispensing. The most commonly used process is the MPPM/PPPM method also known as spanking process. This technology is reaching its limits in terms...
In the fast- paced semiconductor industry the need for package solution arises in order to cope with emerging miniaturization trend. As wafer thickness decreases to 100µm and below, manufacturing challenges arise. Ultra-thin wafers are less stable and more vulnerable to stresses, and the die can be prone to breaking and warping not only during grinding but also at subsequent processing steps.Thinner...