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This paper summarizes the development of the third-generation semiconductors, which are also named Wide - Band-Gap(WBG) semiconductor, typified by SiC, GaN. Since the power devices based on the WBG semiconductor should be operated on harsh environments with high temperature and high frequency, the assembly and packaging should also withstand such environment. The technology of die-attachment and interconnection...
With the rapid development of Integrated Circuit, electrical performance requirement for packages is more and more stringent. In this situation, some research institutes proposed gold bump flip-chip packaging technology, which apply gold as bump material to achieve excellent electrical properties. In this paper, we used finite element analysis software to analyze the thermal mechanical stress and...
Gold bonding wire interconnects is an attractive choice for high performance IC package. As the gold bonding wire of the package may have impacts on the performance of the circuit, thus, it is important to analyze the electrical characteristics of the gold bonding wire in the high-frequency IC package design. In this paper, the electrical characteristics of gold bonding wire used in high frequency...
Ceramic ball grid array (CBGA) modules are high density, high-performance surface mount (SMT) packages. With miniaturization of solder joints in electronic packaging, the intermetallic compound (IMC) which formed at the interface between the solder ball and under bump metallization (UBM) have considerable effects on the reliability of solder joints. In this paper, the effects of Au film thickness...
The formation of interfacial intermetallic compound (IMC) and the mechanical properties of 95Pb-5Sn, 90Pb-10Sn and 85Pb-13Sn-2Cu (in wt.%) flip-chip solder joint with the Ti/Cu/Cu under bump metallization (UBM) after single and three times reflows were investigated. After reflow soldering, Cu3Sn IMC formed on the Cu under bump metallurgy (UBM) for all of the solder alloys. The thickness of the Cu3...
Ceramic column grid array (CCGA) modules are an extension of the ceramic ball grid array (CBGA) packages. CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array CBGA packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of high temperature balls. This...
This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can...
Flip chip technology has attracted considerable attention due to its advantages in providing higher I/O interconnects and better electrical and thermal performances. Solder joint not only offers electrical connection between the silicon chip and the substrate, but also offers mechanical connection in electronics. The reliability of solder joint has been become an increasingly extrusive problem. Among...
Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. The void of the solder joint has a significant influence on the CCGA package reliability. This paper introduced two reflow processes...
Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. The void of the solder joint has a significant influence on the CCGA package reliability. This paper introduced two reflow processes...
Flip chip technology has attracted considerable attention due to its advantages in providing higher I/O interconnects and better electrical and thermal performances. Solder joint not only offers electrical connection between the silicon chip and the substrate, but also offers mechanical connection in electronics. The reliability of solder joint has been become an increasingly extrusive problem. Among...
Ceramic column grid array (CCGA) modules are an extension of the ceramic ball grid array (CBGA) packages. CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array CBGA packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of high temperature balls. This...
This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can...
Ceramic ball grid array (CBGA) package is becoming increasingly popular as a high-density, high I/O count and highperformance packaging formation in the application of the aviation and spaceflight area. However, the undeveloped rework process restricts the development of the CBGA process and the application of the CBGA component. This paper made a research on the rework process of the CBGA package,...
In order to achieve more functions in certain size of the chip, and avoid RC delay caused by long-range interconnect under high density 2D encapsulation at the same time, the researchers focused on the Z direction — 3D packaging. With the increase of storage capacity, and the large scale of data logic fever problems will more and more obvious. So it will not be able to an unlimited number of laminated...
Compared with plastic package, the reliability of ceramic package is very high. With the ever-increasing capabilities of integration, circuits using ceramic package have come the requirements on electronic packaging for providing higher density, higher I/O. For ceramic package using wire bonding, there will be more and more bonding wires because of higher density, higher I/O and input/output pins...
Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. This paper introduced a technology of CCGA package with LGA717 substrate, it specifically discussed the coplanarity, the void rate...
Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue...
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