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Flip chip technology has attracted considerable attention due to its advantages in providing higher I/O interconnects and better electrical and thermal performances. Solder joint not only offers electrical connection between the silicon chip and the substrate, but also offers mechanical connection in electronics. The reliability of solder joint has been become an increasingly extrusive problem. Among...
Flip chip technology has attracted considerable attention due to its advantages in providing higher I/O interconnects and better electrical and thermal performances. Solder joint not only offers electrical connection between the silicon chip and the substrate, but also offers mechanical connection in electronics. The reliability of solder joint has been become an increasingly extrusive problem. Among...
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