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Adding low-cost front-end processing to a passive interposer process flow enables the low-cost processing of diodes, SCRs and bipolar transistors. Using those devices in an ESD protection design allows moving a large part of the ESD protection from the stacked die to the interposer.
Silicon substrates can be strategically isolated or unified among tiers in a through-silicon-via (TSV)-based 3-D integrated circuit (IC) structure, for the suppression of intertier substrate noise coupling or the reduction of grounding impedance of silicon substrates as a whole, respectively. A two-tier 3-D IC demonstrator in a 130-nm CMOS technology was successfully tested and analyzed with respect...
During the manufacturing of 3D stacked-die packaging structures, different operations such as micro bumps formation, underfilling, flip chip and overmold curing will introduce residual stresses, which will interact with subsequent service loads applied to the package and may also influence the growth of cracks in critical locations. In this work, the packaging of a 3D-RAM mounted on a logic die is...
In the study, we report for the first time a novel concept for the mitigation of the TSV-induced stress on the CMOS device performance. This solution consists in selectively integrating an airgap at the time of via-middle TSV processing. In addition to the expected benefits in term of stress management, this new approach is also cost effective, as the TSV processing steps, such as deep silicon etching,...
Power and substrate domains are strategically isolated or unified in heterogeneous 3D integration. In-tier probing circuitry provides accessibility to power delivery and substrate networks in a deep tier of a 3D chip stack and capability of diagnosing intra/inter tier coupling. A two-tier demonstrator was successfully tested in a 130 nm CMOS, 3D-SIC Cu TSV technology.
The semiconductor industry is witnessing a major shift towards heterogeneous 3D integration. Whether companies are active in high performance or consumer markets systems, 3D offers a myriad of opportunities. We will review the different opportunities, indicate process availability and remaining challenges from both design and technology perspective.
Next generation implantable microsystem-based medical devices will have different packaging requirements than current implantable devices such as pace makers. While the packaging must remain biocompatible and provide a bi-directional diffusion barrier, it must also permit the biosensors, microelectrodes, etc to intimately interact with the extracellular environment. A CMOS compatible wafer level packaging...
Based on the requirements for miniaturization of a biocompatible package for medical implants, we derived a process flow for hermetic encapsulation of individual dies. In order to be cost-effective, wafer level based processing is used for this packaging flow. All processes are carried out using conventional clean room tools. Hermeticity of the individual dies or microsystems is ensured by using a...
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