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Polymers are widely used in microelectronics packaging as e.g. adhesives or encapsulants. Low cost and mass production capabilities are the main advantages of these materials. But like all polymers they cannot provide a hermetical sealing due to their permeability properties. The susceptibility to diffusion of liquids and gases through the polymer and along the interfaces is a drawback for polymers...
Medical devices with embedded highly miniaturized microsystems are used as implants in the human body or as non-invasive devices for sensor applications outside the body. Those devices bear quite a lot of economic opportunities but they also do offer unique challenges compared to consumer or automotive applications. Medical applications need to provide biocompatibility, highest miniaturization, rough...
Polymer materials - mainly epoxy resins - are widely used in microelectronics packaging. They are established in printed circuit board manufacturing, for adhesives as die attach glues or for encapsulants as molding compounds, glob tops or underfill materials. Low cost and mass production capabilities are the main advantages of these materials. But like all polymers they cannot provide a hermetical...
This paper describes the potential of different nano- and micro-sized particles as additives for plastic packaging materials for enhanced humidity resistance/barrier enhancement within microelectronic packages as well testing methods for material characterization concerning their humidity diffusion and absorption properties. This topic is gaining increased importance when considering the trend towards...
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