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Thermal compression bonding (TCB) process in combination with a pre-applied underfill material has been developed and investigated for assembling 20 μm pitch Sn-based micro bumps. It is found bonding force has a profound impact on the joint formation behavior. A low bonding force produces bump joints with heavier underfill entrapment and incompletely reacted solder. A higher bonding force leads to...
This work investigates the formation of blisters during annealing an Al2O3 film grown by atomic layer deposition (ALD) on Si. This blistering phenomenon is shown to occur under an external load in the presence of a tensile residual stress: the total membrane stress is a super-imposition of the residual stress of the pre-stressed film and a concomitant stress due to change of blister profile. In the...
This paper discusses mechanical stress measured with micro-Raman spectroscopy in the silicon substrate near Cu-Through Silicon Vias (TSV). A discussion of the relation between the observed Raman shift and the various stress tensor components is given, showing that this relation is often wrongly applied, and that in many cases the compressive stress along the vertical axis of the TSV, dominates the...
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