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Electronics in automotive applications may be used for a number of safety critical systems including lane-departure warning, collision avoidance, drive assist systems, and adaptive cruise control. Furthermore, electronics in fully-electric vehicles may be used for power generation and management. Automotive electronics may be mounted on engine or on transmission or in the base of the automobile and...
Transient dynamic loads in addition to prolonged periods of high temperature exposure are a part of number of high profile applications with high reliability needs. Examples include - electronics in automotive applications may be mounted under the hood or in the trunk of the car resulting in prolonged periods of high temperature exposure followed by operation under vibration while at environmental...
Electronics components in automotive, oil-exploration industries, military applications may be exposed to high temperature and high strain rates when subjected to shock and vibration. In harsh environment applications, electronic products may experience strain rates of 1–100 per sec and environmental temperatures up to 200°C. There is need of material data for leadfree solder alloys at high strain-rates...
Electronic devices used in higher temperatures environments such as well logging in the oil and natural gas industries, under hood automotive applications, military applications may be exposed to very high temperatures around 200°C and high strain rates. Previously, lead based solder alloys have been used in such applications but due to health concern, use of lead-free solder alloys (SAC) has been...
The effect of aging on mechanical properties of SAC 305 at low strain rate has been investigated. For high strain rate constitutive mechanical behavior, a number of researchers relied on Split Hopkinson Pressure bar and the strain rate range is from 500/s to 3000/s. However, for typical drop and shock, the strain rate range is from 1/s to 100/s. There is a general scarcity of data for solder materials...
Combined effects of high temperature and vibration can significantly attenuate the life of electronics used in automotive, military and navigation applications. No prior studies exist which examine the simultaneous effects of high temperature plus vibration and analyze failure modes and failure criterion for MEMS based gyros and accelerometers. Accelerometers and gyroscopes make a great complement...
Material data on properties at elevated temperatures and high strain rates is scarce. There is lack of material models that capture the mechanical deformation under transient dynamic loads at elevated temperatures. Electronics in downhole drilling, automotive and aerospace applications may often be exposed to high temperature during storage, operation and handling in addition to high strain rate transient...
High reliability electronics may be subjected to thermo-mechanical fatigue loads under harsh environmental conditions, which finally gives rise to solder joint failure. So to ensure safety and to avoid unexpected situation or accident, physical damage state and remaining useful life of electronic modules must be quantified prior to any future redeployment. Study on the effect of aging and the effect...
Electronics in downhole drilling, automotive and aerospace applications is expected to sustain prolonged periods of operation at high temperature while being subjected to shock and vibration. High temperature shock and vibration loads may be generally in the strain rate range of 1-100 per sec. Material data on properties at elevated temperatures and high strain rates is scarce. There is lack of material...
Commercial electronics parts are increasingly being used in high-g fuzing applications. Sustainment of long-term systems requires the understanding of the survivability limits on newer fine pitch part architectures. In this study, the survivability of 0.4mm pitch and 0.5mm pitch parts at acceleration levels upto 50,000g have been studied for bare test boards, underfilled test boards, and potted test...
Electronics in military and defense applications may be stored for prolonged period of time prior to deployment in mission critical applications. In addition, electronics in automotive applications may be used underhood, mounted directly on-engine and on-transmission with expectation to survive in excess of 10 years, 100,000 miles of usage in a variety of environments. Previous researchers have studied...
Portable products such as smartphones and tablets stay in the powered on condition for a majority of their operational life during which time the device internals are maintained at higher than ambient temperature. Thus, it would be expected for interconnects in portable products to be at a temperature high than room temperature when subjected to accidental drop or shock. Furthermore, electronics in...
The industry is going through a transition in material sets for second level interconnects including adoption of leadfree solders. High-rel systems may often have a mix of components with different solder alloys in the printed circuit assemblies including both leaded and leadfree solders because some original leaded components may only be available in leadfree configurations. In this paper, the potential...
Electronics in automotive underhood applications may be subjected to temperatures in the neighborhood of 150°C to 175°C. Several of the electronics functions such as lane departure warning systems, collision avoidance systems are critical to vehicle operation. Prior studies have shown that low silver leadfree SnAgCu alloys exhibit pronounced deterioration in mechanical properties even after short...
Industry migration to leadfree solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Sn-Ag-Cu family of alloys like SAC105 and SAC305. Electronics subjected to shock and vibration may experience strain rates of 1–100 per sec. Electronic product may often be exposed to high temperature during storage, operation and handling in...
Leadfree solders have been used as interconnects in electronic packaging, due to its environmental friendly chemical property. However, those materials may experience high strain rates when subjected to shock and vibration. Consequently, failure will occur to electronics in those situations. Therefore, knowing the material properties of lead-free solders are extremely important, but research on mechanical...
Relatively little is known about the performance of the doped Ball Grid Array (BGA) packages used in semiconductor industries, even though newer products are widely being introduced to the market. This work experimentally investigates the doping effects of the BGA packages with SAC 305 alloys, caused by the vibration loading. This experiment focuses on the vibration fatigue life of 15 mm CABGA packages...
Electronic systems may be subjected to prolonged and intermittent periods of storage prior to deployment or usage. Prior studies have shown that leadfree solder interconnects show measurable degradation in the mechanical properties even after brief exposures to high temperature. In this paper, a method has been developed for the determining equivalent storage time to produce identical damage at a...
Electronics subjected to shock and vibration may experience strain rates of 1–100 sec−1. High strain rate data is scarce for leadfree solders at strain rates in the range of 1–100 sec−1, typical of drop-impact, shock and vibration. A new experimental method has been developed to achieve constant strain rate in the neighborhood of 1 to 100 sec−1 during the entire deformation history. SAC105 and SAC305,...
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