The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper presents a comparative study of three types of doubly salient machines (DSMs), i.e. wound field variable flux machines (VFMs), hybrid-excited stator slot permanent magnet machines (HSSPMs), and stator slot permanent magnet machines (SSPMs). Two dimensional finite element (FE) modelling is carried out to investigate the electromagnetic performance of the VFM and the SSPM based on a global...
This paper provides a comprehensive analysis of performance difference in the flux reversal permanent magnet (FRPM) machines with various magnet arrangements. The influence of different PM arrangements on working airgap flux density harmonics is firstly revealed. The torque variation against rotor pole number for four PM arrangements is then analyzed. Results show that each arrangement exhibits superiority...
This paper proposes an axial flux magnetically geared (AFMG) permanent magnet (PM) machine for power split application in hybrid electric vehicles (HEVs). The proposed AFMG machine has the merits of simple structure and improved torque density by combining a magnetic gear (MG) with a PM machine. The machine can realise power split without changing the function of MG and PM machines. The input mechanical...
In this paper, a novel axial flux magnetically geared machine (AFMG) is presented. The proposed AFMG machine consists of stator segments equipped with concentrated windings and two permanent magnet (PM) rotors with different pole-pair numbers. The proposed AFMG offers the merit of simple mechanical structure and is suitable for applications with limited axial space. To maximize the torque, both 2D...
Low density micro-bumps were required for assembly of different technologies connection within 3D and 2.5D packaging. 6μm and 8um bump heights after reflow are required for 15μm and 25μm (Cu/SnAg) diameter micro-bump, respectively. At same time, the pattern density of 15um and 25μm diameter micro-bump are 0.045% and 0.127%. This paper reported the process challenges, evaluation and development. The...
In supersonic flight, severe aerodynamic heating takes place at the nose of blunt body and causes ablation. Accurate prediction of aerodynamic heating and construction of proper thermal protection system are required. The numerical study on a reduction of aerodynamic heating by opposing jet has been conducted. Flow field around a hemisphere model is calculated in supersonic free stream of Mach number...
Cost remains a key factor for implementation of Through Silicon Via (TSV) in high-volume manufacturing. As compared to via-first and via-middle TSV, via-last (from wafer back-side) TSV possesses the advantage of a more simple process flow and more flexibility in integration for more varied applications. Previously, a cost model analysis for Through-Silicon-Interposer (TSI) using via-first TSV has...
For both power/ground and data carrying TSVs, TSV resistance is preferred to be as low as possible. Power/ground TSVs should exhibit larger TSV capacitance so that TSV can act as a decoupling capacitor while data TSVs should exhibit low TSV capacitance enabling larger data rates. Monolithic integration scheme employing the annular isolation ring to isolate the data and power/ground TSVs is proposed...
CSEM in its photovoltaic activity has developed white solar modules with conversion efficiencies above 10%. This innovative PV technology is particularly attractive to be used in building industry where PV elements can blend into building skin and become virtually hidden energy sources. The new Swiss company called Solaxess is now working on the industrialization of this new technology and the first...
BSR (back-side via revealing) of TSV wafers after temporary bonding is very critical process within 3D integration. Adhesive performances of the temporary bonding were inspected step by step within BSR process by IR inspection system. We found out the delamination happened after backside dielectric deposition at specific pattern. The delamination area and structure were inspected and reported in this...
Folded-type waveguide is a kind of significant slow wave structure (SWS) for developing high power millimeter wave and terahertz wave source. This paper reports the study on the folded type waveguide and its applications in millimeter wave and THz source in Vacuum Electronics National Laboratory(VENL) in China, in which the analysis and simulation of the RF properties and the electron beam-wave interaction...
Microstructure analysis plays an important role in the reliability study of copper Through-Silicon Vias (TSVs). While conventional 2-dimensional (2D) Electron Back-Scatter Diffraction (EBSD) is a useful technique, 3-dimensional (3D) EBSD characterization provides a more accurate picture of the TSV microstructure. Information that is missing in 2D observations, such as grain shape and volume, can be...
The cost is always an important parameter for the new technical application. Through Si Via (TSV) technology becomes hot topic since image sensor application. We setup cost model according to our process flow and throughput for the cost study and reduction of 300mm TSI interposer. High cost area was calculated through the cost model. Full TSI process flow was separated as TSV, BEOL, Top UBM, TDDB,...
Through silicon via (TSV) has emerged as an essential enabler for the next generation of integrated circuits and systems for continuous performance growth and functional diversification. TSV is commonly fabricated by high aspect ratio deep silicon etching, lining with dielectric materials for electrical isolation and super-conformal filing with copper to provide the electrical path. Due to the large...
Copper Through-Silicon Via (Cu TSV) is becoming a key technology for three dimensional (3D) packaging and 3D integrated circuit (IC) applications. The microstructure of the Cu TSV is important as it not only affects the electrical properties, but ma y play a role in its reliability such as protrusion. In this study, physical vapor deposition (PVD) and electroplated (ECP) Cu TSV microstructure evolution...
Through-silicon-via (TSV) as a key enabler for three-dimensional (3D) integration provides electrical connections between stacked functional dies. This work examines the thermal characteristics of the TSV arrays and experimentally demonstrates that TSV arrays embedded in silicon substrate can be utilized as an effective heat removal element that helps in both heat dissipation and management of 3D...
We have analyzed the influence of space charge on potential distribution for a planar parallel vacuum microelectronics diode by using of the Posson equation, derived the relationships of electron transit time under considering and neglecting the influence of space charge from the basic definition of electron transit time. Some relative application of those relationship also were provided as instances.
In this paper, we successfully demonstrate ultrahigh density (> 106 cm−2) Cu-Cu interconnects of 6-µm pitch using wafer-on-wafer thermo-compression bonding. This is a significant improvement from our previous achievement of 15-µm pitch. In addition, we integrate Cu sealing frame with excellent helium leak rate to the bonded structures to promote the overall bond reliability. On top of that, temporary...
For MEMs application, we developed dense TSV coils and stacking technology. The dense TSV coils (20um width, 10um space, 90um depth) were void-free filling by Cu. 8 chips stacking with dense coils are demonstrated by conductive adhesive. The resistance, inductance and magnetic field of 8 stacked dense coils are characterized and reported in this paper.
The digital substation and the implementation of IEC61850 are fundamental to the future of protection relays. The IEC61850 standard, "Communication Networks and Systems in Substation", provides the basis for the communication system for the digital sub-station's protection and control schemes. Section 9–2 defines the Ethernet based communication network providing data transfer between primary...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.