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Al2O3 coated graphene foam (GF@Al2O3) composites are proposed by depositing insulating Al2O3 particles on the graphene with a simple method. The content of Al2O3 on graphene could be gradually adjusted by changing Al(OH)3 radio in solution. Al2O3 coated graphene foam composites are used as effective three dimension (3D) interconnected framework of paraffin phase change materials to increase thermal...
Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
Transparent die attach materials (DA) with moderate thermal conductivity without yellowing are preferred for mid-power LEDs, which dominate the LED backlighting and general solid-state lighting markets. A novel DA was developed based on a new kind of silicone base material specifically designed and synthesized. Compared with widely used transparent DA of KER-3000-M2 from Shin-Etsu Chemical Co., Ltd...
With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly,...
High quality vertically aligned carbon nanotube (VACNT) arrays have been synthesized on bulk Al alloy (Al6063) substrates with an Fe catalyst using low pressure chemical vapor deposition (LPCVD). The pretreatment process of the catalyst was shown to play a critical role, and it was studied comprehensively and optimized to grow high quality VACNT arrays within a wide range thicknesses of catalyst layer...
With excellent current carrying capacity and extremely high thermal conductivity, carbon nanotube (CNT) has been proposed for interconnect and thermal interface material (TIM) applications. In this paper, we present a method of fabricating aligned CNT/copper composites on the silicon substrates and in the silicon dioxide vias. Electrical measurement of the CNT/copper composite vias demonstrates much...
Due to its remarkable properties, carbon nanotube (CNT) was widely used in different areas, especially in electronic packaging for the improvement of the adhesion and thermal conductivity. CNT as an emerging thermal interface material (TIM) is now widely used to improve thermal dissipation in electronic packaging. CNT array as TIM is suffering from poor adhesion between CNTs and substrate in packages...
A novel heat spreader with aligned CNT arrays synthesized on both sides is demonstrated to provide a low cost, effective thermal management method for high-brightness light emitter diode (HB-LED) packaging and microelectronic packaging. With this heat spreader, Si device and heat sink can be directly bridged and no further TIM or individual heat spreader is needed. The thermal resistance of the novel...
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