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The package-on-package(PoP) stacking technique with the advantages of printed-circuit-board(PCB) space saving, flexible combination and assembly has become a kind of mainstream solution for the high density package. However, the conventional PoP technology is limited with constraint aspect ratios of I/O density between the top and base packages under conventional solder ball interconnection approach...
In this paper a four-layer package-on-package(PoP) stacking structure was introduced which allowed the whole package using fine pitch solder ball and consequently improved the interconnection I/O density between the neighboring packages.
This paper presents design and simulation of an impedance matching network for GPS using embedded capacitor material which can substitute conventional matching network implemented by discrete lumped devices. The matching networks with ideal devices and commercial Panasonic discrete devices are simulated by ADS, and the one using embedded capacitor material is designed and simulated by 3D field solver...
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