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We report on the ESD performance of dual well and triple well, silicide-blocked stacked NMOSFETs in a 45 nm CMOS technology. Triple well stacked NMOSFETs have a 1.5X higher HBM failure voltages compared to dual well designs. Further, we report on the effect of gate-biasing on the ESD performance of dual well, gate-silicided, silicide-blocked 2.5 V stacked NMOSFETs. For gate voltages (VGS) larger than...
Decrease of the drain silicide-blocking-to-gate spacing in gate-silicided-ESD-NMOSFETs improves the TLP and HBM failure levels up to 30%, while no effect is observed when decreasing the source silicide-blocking-to-gate spacing. Failure analysis and simulation results show that current crowding in the drain silicide region accounts for the difference in failure current for the devices.
Process and design optimization of NMOSFETs with ESD implant is presented. A 2 V reduction in trigger voltage, a 30% higher failure current, 50% reduction in on-resistance is achieved with a 13X increase in leakage current for a 2.5 V NMOSFET. Self-protected NMOSFETs with ESD implant enables 40% or larger decrease in NMOSFET area for a non-mixed voltage and mixed voltage I/O.
Electrical and SEM analysis of gate-silicided (GS) and gate-non-silicided (GNS) ESD NMOSFETs in a 65nm bulk CMOS technology show that the failure mechanism switches away from classical drain-to-source filamentation when the silicidation between the silicide-blocked drain/source and the polysilicon gate is avoided. For 2.5V thick oxide devices, drain-to-substrate junction shorting was observed, whereas,...
We present for the first time an ESD protection strategy using silicide-blocked PMOSFETs to improve negative-mode external latchup robustness by eliminating N+ junctions directly connected to the I/O pad. 100 ns TLP data of thin (Tox=1.25 nm) and thick oxide (Tox = 5.2 nm) silicide-blocked PMOSFETs in a 65 nm CMOS technology show failure currents of ~6 mA/mum and ~5 mA/mum respectively, suitable for...
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