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In this experiment, the vibrational performance of various lead-free doped (micro-alloyed) solder paste alloys on 15mm BGA packages were investigated. The Primary Goal of this test is to find a manufactureable solder paste that will mitigate the effects of aging on lead free solder joints. The results discuss the effects of different paste materials, the effects of doping level, and reflow profile...
In this experiment, the thermal performance of various lead-free doped solder paste alloys on leaded and leadless packages on laminate substrates were investigated. The Primary Goal of this test is to find a manufactureable solder paste that will mitigate the effects of aging on lead free solder joints. The results discuss the effects of different paste materials, the effects of doping level, and...
Ball grid array (BGA) packages have rapidly become the popular choice of manufacturers in the semiconductor industry over the past decade. The characteristics of BGA packages in a vibration environment have a deleterious effect after long term isothermal aging. The effectiveness of this characteristics was demonstrated with promising results through vibration testing of SAC 105 and 305 alloys. This...
AlGaN/GaN based heterostructures are used to fabricate high electron mobility transistors for the purpose of a DNA hybridization sensor. Photodefinable PDMS is used to encapsulate the entire device except the gold sputtered gate area. The gold coated gate contacts are functionalized with thiolated ssDNA. The fabricated device is used to detect DNA hybridization of Salmonella DNA of two different concentrations...
Thermal oxides on the Ga-face of low defect density bulk gallium nitride (GaN) were controllably produced under varying conditions and subsequently analyzed. The thermal oxidation was performed in a dry oxygen atmosphere at different temperatures and different oxidation times. Each oxide layer was identified as the monoclinic β-Ga 2 O 3 by a θ–2θ X-ray diffraction (XRD) scan. Complementary...
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