The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With the ever increasing trend of cramming more transistors on the silicon and the consequential increase in the thermal design power, combined with stacked die and multiple die configurations inside the package footprint, optimized coolant chambers becomes an imperative design need to remove heat efficiently from the silicon. Liquid cooling is investigated to efficiently meet the challenges of high...
Air-cooled based thermal margining tool is simple, less costly and reliable cooling solution compared to liquid-cooled thermal tool. Air-cooled thermal tool is used by many Intel® groups for different purposes such as CPU, chipset or ASIC debug and validation. However, conventional air-cooled thermal margining tool do not provide sufficient cooling due to the increasing challenges in thermal management,...
Thermal tools provide temperature margining capability by varying the case temperature at silicon thermal design power (TDP). They are used for process, voltage, temperature and frequency (PVTF) testing by Intel's post-silicon validation customers across servers, desktops, mobile and graphics segments. Thermal margining tools are widely used in silicon debug validation by varying the case temperature...
Thermal interface materials (TIMs) are widely used as heat conductive medium between a heat source and a heat dissipating device. A high thermal performance TIM can provide a low thermal resistance path and thus improve the thermal management of the heat source. This paper presents various criteria for TIMs used in silicon validation environment in addition to the well-known criteria for high performance...
Validation platforms are used to validate processors/chipsets to ensure Intel providing world-class quality and reliable products. In this paper, experimental methodologies of thermal, mechanical, acoustics, shock and vibration and ergonomic tests are demonstrated. These tests are essential to enable the boot-out-of-the-box model with increased complexities of the platforms while meeting the budget...
Combination of higher cooling power with the introduction of fully buffered dual in-line memory module (FBD) memory technology and accessibility requirements for server validation platform have driven cooling fan selection at relatively high speeds resulting in high acoustic noise. Most validation platforms are open systems and hence the acoustic noise becomes worse without system walls to act as...
Thermal characterization provides data on the thermal performance of electronic components under given cooling conditions. The most common thermal characterization parameter used to characterize the behavior of electronic components is the thermal resistance. In this work, experiments are conducted to obtain thermal characterization data for different chips in a multichip package. Using this data,...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.