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In this paper, strain gauges are used to measure the dynamic response during drop impact. A set of high-speed data acquisition system is used to capture the real-time strain response of critical locations. Finite Element Modelling is used to determine where to place the strain gauges. Two board level drop impact test methods, A and B, are compared by the strain gauge measurements. Results show significant...
The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations...
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