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A flip-chip bonding process using an IR laser was developed. A focused laser beam can be irradiated on solder balls directly through a silicon wafer using a laser beam of 1064 nm. The focused diameter of a laser beam is around 200 mum which is compatible with the solder ball pitch. A laser scanning system was used for scanning multi-solder-balls with a pre-programmed path. The laser flip-chip bonding...