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A sensor system that measures the 3D data of the object after projecting the cone shaped beam to the object of measurement to create a round mark and receiving this image through camera, was studied. This sensor system, when attached to a robot, will enable diverse application works, and in this study, such was proved by displaying the tracking work for the defect fabricated randomly.
We have performed a single X-ray image extract of three-dimensional shape information (edges and vertex) by using characteristics of a specific material with a specific size (thickness). We have used that fact that the intensity distribution X-ray images decreases around edge areas in the form of exponential function and used the least square method and the coefficient of determination value to extract...
The present study explored a flip-chip packaging method where transmission bonding is performed using the laser beam transmission rate of Si, the main material of flip chips. Here, the transmission of Si by a laser beam using laser wavelength in the IR domain (1,064 nm) was demonstrated through experiments. Further experiments were then conducted where the results were applied to actual flip chip...
As the technology of semi-conductor chip progresses to pursue high density and high speed, flip-chip technology recently has played a successful role to overcome technological limit of the existent gold wire bonding technology made a connection with outside terminal. Flip-chip is systemically different to the existent chip that transfers electrical signal by connecting wires to the chip externally...
X-ray images are heavily affected by noise which makes normal image processing not workable. This paper suggested a new method to identify the primary 3-D shape of an embedded object and its pose by using only single X-ray image. The image feature consists of corner points and edge/intersection lines of adjacent surfaces. The intensity of an X-ray image is attenuated exponentially with increasing...
A flip-chip bonding process using an IR laser was developed. A focused laser beam can be irradiated on solder balls directly through a silicon wafer using a laser beam of 1064 nm. The focused diameter of a laser beam is around 200 mum which is compatible with the solder ball pitch. A laser scanning system was used for scanning multi-solder-balls with a pre-programmed path. The laser flip-chip bonding...
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