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This paper reports a method of measuring the on-chip thermal stress for silicon resonant accelerometer (SRA). This method could be used to evaluate the stress-temperature characteristic of SRA, and that would help to focus the problems exist in SRA. Clamp-clamp Double Ended Turning Fork resonator is used as a basic measurement unit. Analysis of the accuracy and noise in stress measurement is given...
In this paper we present the recent improvement of a silicon micro-mechanical vibrating beam accelerometer (SVBA) which combine the advantage of low cost of silicon MEMS fabrication technology, small size vacuum wafer level package, low noise low power application-specific integrated oscillation circuit and digital frequency demodulation technology. Under room temperature, it has achieved bias instability...
This paper gives a detail description of a silicon vibration beam accelerometer which was fabricated by SOI technology and encapsulated in a wafer level vacuum package. The wafer level package gives advantage of small size and low cost, but also produce additional residual stresses that increased the temperature coefficient of the vibration beams. To solve this problem, the sensing structure was redesigned...
A novel vertical field plate (VFP) structure with low specific on-resistance (Ron,sp) is proposed. The VFP is inserted in the field oxide of the drift region with heavily doped N pillar parallel to the trench oxide layer (TOL), which depletes fully the drift region to decrease Ron,sp effectively and enhances the bulk field (ENBULF). The VFP optimises the bulk electric field to increase the breakdown...
The implementation of the dual-mass MEMS vibratory gyroscope in device-level vacuum packing was presented. The electrostatic actuation and capacitive sensing methods were adopted in electrical design of gyroscope. The self-resonance drive circuit with automatic gain control was employed in the drive closed-loop, and the open loop detect circuit was used. In order to reduce environment impact on the...
A micromechanical silicon resonant accelerometer (SRA) with micro leverage mechanism amplifying the inertial force is presented. SRA consists of a pair of double-ended tuning forks (DETF), a proof mass and a micro lever mechanism. Firstly, the relation between frequency shift and applied force of DETF is modeled with the classical Bernoulli-Euler beams theory and then simulated by the finite element...
The silicon microgyroscopes are very sensitive to the residual stresses, which degrade the microgyroscopes performance. This study used finite element analysis to simulate the residual stresses induced during the packaging process. The silicon microgyroscope is fabricated with SOG (silicon-on-glass) technology and packaged with ceramic packages. FEM simulation based on a simplified structure of the...
This paper presents the design, simulation, fabrication and preliminary test results of a monolithic triaxial micromachined vibratory gyroscope. The device is a monolithic integration of two uniaxial in-plane (x- and y-axis) gyroscopes and one uniaxial out-of-plane (z-axis) gyroscope and the three individual gyroscopes are all actuated by electrostatic force and detected by capacitors. In order to...
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