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Pressure-less sintering of Cu flake paste is achieved assisted by hydrogen plasma process toward die-attach technique of next-generation high-temperature power semiconductor devices. The sintered paste shows high bond strength aver 50 MPa, showing large abnormal grain growth at the bonding interface, with homogeneously distributed void of porous interconnection layer. Our results indicate that still...
Room temperature Young's modulus, shear modulus and Poisson's ratio were measured by Resonant Ultrasound Spectroscopy (RUS) for a total of 29 skutterudite specimens cut from four hot pressed billets: (i) two p-type (Ce 0.9 Fe 3.5 Co 0.5 Sb 12 ) billets, (ii) one n-type (Co 0.95 Pd 0.05 Te 0.05 Sb 3 ) billet with 0.1atomic% Ce addition...
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