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This paper reports the effect of ion exchange treatment of muscovite particles on the properties of muscovite filled epoxy composites. Ion exchange treatment was performed in order to improve the muscovite-epoxy interfacial adhesion and dispersion in the epoxy matrix. Fourier Transmission Infrared (FTIR) analysis showed that octadecyltrimethylammonium bromide (ODTMAB) was successfully exchanged with...
The Intel Malaysia Electronic Packaging Higher Education Program Team is proudly one of the teams to benchmark among the industry for their engagement with Malaysian universities. This team was formed with the objective of collaborating with Malaysian universities to accelerate the advancement of research and curriculum to meet rapid technology changes in the area of electronic packaging materials...
This paper reports the preparation and properties of polyhedral oligomer silsesquioxanes (POSS)/epoxy composites. Two compositions of POSS by volume, typically at 1% and 2% were used as filler in epoxy matrix. The composites were studied in terms of flexural, thermal and morphological properties and the results show an improvement in several properties. Flexural strength of epoxy was found to increase...
This article describes the thermal and mechanical behavior of alumina-filled epoxy composites. The epoxy matrix was reinforced with increasing amount of alumina particles in the range of 10-30% by weight using resin transfer molding technique. From the flexural test results, it was observed that the flexural modulus increases with increasing a-alumina content from 10 to 30 wt% with 30 wt% of a-alumina...
This paper focuses on the exposed-die molded underfill (MUF) and overmold as underfill (OMUF) technologies for flip chip in the form of a molded matrix array package. A series of mold compounds were selected for this evaluation. MUF and OMUF parts were successfully assembled and subjected to reliability stress tests. All the materials have high MUF and OMUF assembly process yields. The evaluations...
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