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Presented in this paper is a development of a high-performance piezoresistive micro-accelerometer based on the slot etching in the EB (eight-beam) structure for the vibration detection of high speed spindle. The proposed SEB (slotted eight-beam) structure consists of a proof mass supported by four slotted sensing beams and four suspension beams, which in order to improve the trade-off between the...
A Micro-electromechanical systems (MEMS) sensor with the variable cross-section micro-cantilever was designed to measure the fluid viscosity. Due to the quality factor of micro-cantilever under the torsional resonance is much higher than that under the first order flexural resonance, the fluid viscosity measuring accuracy under the torsional resonance is much higher. Then an exciting method named...
In order to establish optimal structure for micro vibration due to electric spark occurs in the faulty cable. A novel acceleration sensing with supplement beams structure utilizing the piezoresistive principle is presented and compared with traditional structures. The mechanical model and its simulation solution are built up and carried on, including the calculation of the sensitivity and frequency...
The Micro Electro Mechanical Systems (MEMS) density sensor is developed to achieve in-situ measurement of fluid density rapidly. The sensor's sensitive chip with a rectangular microcantilever is fabricated using MEMS technology. In the sensitive chip, an Au coil and four piezoresistors are fabricated on the rectangular microcantilever. When the sensitive chip is placed in the uniform magnetic field...
In this paper, we describes an integrated MEMS tactile tri-axial micro-force probe sensor based on piezoresistive for Minimally Invasive Surgery (MIS) as it's micro-structure, three-dimensional measurement and high resolution up to be micronewton (μN) scale. The sensor is 4 × 4 × 20.9 mm3. The sensing element of the sensor is fabricated on Silicon on Insulator (SOI) wafer by surface and bulk micromachining...
A kind of micro piezoresistive pressure sensor with stable performances under high temperature is designed based on the silicon on insulator (SOI). Through analyzing the stress distribution of diaphragm by finite element method (FEM), the model of structure was established. The fabrication operated on SOI wafer, which can be used in extreme high temperature environments, and applied the technology...
In order to satisfy the different packaging requirement of individual sensors in the monolithic multi-sensor chip, a hybrid packaging method is presented in the paper. The packaging method of multi-sensor makes use of high-resolution stereolithography system of photopatternable resin constructing the main packaging structure in the way of batch production, low cost and good resolution. A monolithic...
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