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Room temperature GaN-Si direct wafer bonding was done by surface activated bonding (SAB). At first, a feasibility study using GaN template has been done. Then, crystal-face dependence of the bonding results for freestanding GaN substrate has been investigated between Ga-face and N-face. The results of Ga-face to Si bonding are better than that of N-face to Si bonding such as higher bonding energy...
This paper functions as a feasibility study to prove increase of thermal performance of patterned Cu with an analytic model that takes into account the surface roughness. The thermal resistance is described as a function of the bonded surface area.
A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.
This paper gives an overview of different methods of condition monitoring (parameter measurement, canary principle, life cycle unit). It describes the advantage of combining the condition monitoring (CM) methods to improve the reliability of electronic systems. A workflow to implement CM methods is described as well as different system levels and the associated applicable CM method. The paper concludes...
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