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Processing of bump-less or embedded microbumps is introduced in this paper as an approach which enables scaling microbumps for below 10um pitches. Landing wafer is standard damascene process and in top wafer bumps are embedded in a soft backed polymer. Later during thermo-compression bonding this polymer is cured to bond two chips together. Process flow and results of TC bonding is discussed in this...
In this paper,the wettability, quality of joint formation and electrical yield of daisy chains in 3D stacks when using Cobalt and Nickel as UBM with different finish layers such as immersion Au, ELD NiB, ELD Cu and SAM are investigated. The performance of the stacks are characterized by cross-section SEM images, EDS analysis and electrical resistance measurement of the daisy chains.
Cloth-like electronic devices are of great interest for the rapid development of wearable electronics. Herein we report a flexible and high-performance supercapacitor constructed on conductive cloth. In order to improve the electrochemical capacity, nickel nanocone arrays were electrodeposited onto a piece of conductive cloth (nickel plated polyester plain cloth) for the nickel current collector (NCC)...
In this paper a bump-less process is introduced in order to further scale down the pitch of microbumps. Electrical resistance measurement, Cross section SEM and mechanical characterizations show successful 3D stacking using proposed method.
In this paper a reflow process for fine-pitch micro-bumps is studied. A mathematical model for the reflow process is proposed and verified by experimental measurements. The influence of reflow profile parameters on the shape of micro-bumps, will be discussed using three commercial reflow ovens. Furthermore, measurement results of bump height variations after reflow over a 300mm wafer will be presented.
A new butterfly-shaped hexanuclear complex [Ni 6 L 4 H 2 O(C 5 H 5 N) 4 ]·2DMF (L=anion of N-(3-t-butylbenzoyl)-5-bromosalicylhydrazide) has been synthesized and characterized structurally and magnetically, which contains two trinuclear [Ni 3 L 2 (py) 2 ] subunits bridged by two μ 2 -O(carbonyl) and one μ 2 -O(H...
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