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Miniaturized thermoelectric coolers is one of the most promising active heat dissipating methods in hot spot cooling, laser cooling and other applications. Improving mechanical strength can potentially boost the reliability of this technology. In this paper, simulations and mechanical compression experiments were carried out on miniaturized thermoelectric coolers both with and without underfiller...
Novel thermal management technologies based on multiwalled carbon nanotube (MWNT) bundles are now under development, aiming at improving the cooling of microelectronics packages.
As power density in electronic system is approaching a level that conventional cooling methods canpsilat handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using carbon nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is...
Continued miniaturization in combination with increased performance of microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability of systems and devices. Development of advanced thermal interface materials has been identified as crucial, absorbing a portion of the advancements necessary within packaging technology. In this paper we introduce...
The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently,...
The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating powers and effective thermal conductivity on cooling effects have been obtained in the case studies, and the 2D fin array simulation results have been compared with our previous 1D fin...
The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and...
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