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Low-temperature sintering bonding has been proposed as an alternative technique for the soldering to overcome such high operating temperature in wide-gap semiconductor power devices. Ag nanoparticle sintering is one of the candidates in die-attach bonding, but there are certain obstacles for mass production mainly due to the high cost of silver. In addition, metal nano-particle paste including Ag...
The analysis of electro-optical properties of 635 nm InGaP/InGaAlP resonant-cavity light-emitting diodes (RCLED) with AlGaAs mirrors is presented. We show that including the periodic gain medium with slightly p-doped electron stop layer in both side of active layer improves the efficiency of such device due to increasing the electron capture efficiency in the quantum wells and decreasing the electrical...
Light propagation in slab photonic crystals can have a negative phase velocity and accumulate a negative optical path length. We present experimental results on guiding and dispersion properties when the phase index is approximately -1.
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