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Transmission lines carrying high-speed I/O signals that traverse through different metal layers in a printed circuit board suffer from return path discontinuities. As a result, significant amount of electromagnetic energy can couple to surrounding circuits and the power distribution network. In this work, we designed three printed circuit board (PCB) test vehicles using different power distribution...
Transmission lines carrying high speed I/O signals can couple significant amount of electromagnetic energy to power distribution network (PDN) which can then adversely affect signal and power integrity of the entire electrical system. Similarly the reverse is also true. In this paper we present three printed circuit board designs with different power distribution topologies and show through measurement...
Signal return path discontinuities, parasitic inductance and impedance mismatch within interconnects are major factors that contribute to degraded high-speed signal quality in three-dimensional (3D) integrated circuits and systems. In this paper, we apply an alternate power delivery method and a novel I/O signaling scheme to a 3D system to address these issues. Two test vehicles made of stacked PCBs...
In this paper, the model for a developed electromagnetic actuator is established based on experimental data. Through analysis of its simplified control system, the range of control current during vertical stroke of the actuator is derived. Due to the existing constraints of both control current and suspension working space, model predictive control (MPC) methodology is applied in active control for...
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