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Transmission lines carrying high speed I/O signals can couple significant amount of electromagnetic energy to power distribution network (PDN) which can then adversely affect signal and power integrity of the entire electrical system. Similarly the reverse is also true. In this paper we present three printed circuit board designs with different power distribution topologies and show through measurement...
Signal return path discontinuities, parasitic inductance and impedance mismatch within interconnects are major factors that contribute to degraded high-speed signal quality in three-dimensional (3D) integrated circuits and systems. In this paper, we apply an alternate power delivery method and a novel I/O signaling scheme to a 3D system to address these issues. Two test vehicles made of stacked PCBs...
The safety organization technical measurement of AVC put into operation in district sub-transmission network and AVC access control security mechanism based on portrait recognition technology are discussed in this paper. The security organization measures, safety technical measures and operation danger point control are discussed in operation safety organization technical measurement of district sub-transmission...
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