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This paper presents the design and the practical realization of a measurement stand dedicated to thermal characterization of electronic packages. The standard Dual Cold Plate (DCP) solution is enhanced with the Peltier Thermo-Electric Modules (TEMs) and a tensometer bridge. The TEMs are automatically controlled by a special circuit so as to provide either constant case temperature or constant thermal...
This paper presents the design and the practical realization of a measurement system dedicated to fast real-time multichannel registration of electronic system thermal response. The response is registered in parallel channels with a frequency up to 1 MHz. Such a high frequency is required for the thermal identification of electronic systems. The designed circuit is used here for the investigation...
This paper discusses the possibility of estimating in real time internal heat source temperature values based on the sensor measurements available only at circuit boundaries. The chances and some fundamental limitations of such a boundary temperature scan approach are illustrated based on an example of a test ASIC. This circuit contains a matrix of heat sources which can be individually switched on/off...
This paper presents simulations and measurements of an integrated PTAT sensor. The sensor is equipped with an overheat protection circuit and was implemented in an ASIC containing matrices of heat sources and junction temperature sensors. The PTAT sensor is used for temperature monitoring and it is responsible for issuing warning signals in a case of chip overheat. Particular attention is paid to...
This paper presents measurements and simulations of a test integrated circuit. The circuit contains a matrix of heat sources and a set of temperature sensors, what renders possible measurement of circuit temperature in real cooling conditions inside a closed package. The measurements are validated for different patterns of power dissipation and cooling conditions with numerical simulations. Based...
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