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A novel method has been developed to fabricate p-pad-up GaN-based thin-film light-emitting diodes (TF-LEDs) with electroplated metallic substrates. First, a Ni/Ag/Ni/Au mirror severed as p-contact is totally covered by an insulating SiNx layer, which separates n-contact from the p-contact. Then, a copper layer connected with the n-contact was electroplated to a thickness of about 120 μm as a metallic...
The Zn-Al solder alloy is a promising candidate to replace the conventional high lead solders (Pb-5Sn, Pb-10Sn) in automotive applications, which work in a harsh environment combined with thermal and mechanical loads. In this work, the effects of concurrent vibration and elevated temperature on the Zn-Al solder interconnection on Cu or Ni-P plated Cu substrates were studied. The test samples by forming...
A need for a drop-in lead-free high temperature solder to replace high lead solders has been stringently desired for the die attachment in SiC power devices. Currently, the gold-based solders (Au-20Sn, Au-12Ge, and Au-3Si eutectic solders) and nano-silver paste are widely applied for their excellent high-temperature properties. But due to high price and high-demand of a processing facility, their...
This paper makes an industrial experimental study of the influence of crystal growth characteristics, crystal growth striations and rotating magnetic field on the growth characteristics of ingot cellular crystal in the production process of high purity aluminum by vertical high purity aluminum directional solidification equipment and hereby optimizes productive and technical parameters, thereby successfully...
In order to improve quality of reconstructed image in electromagnetic tomography (EMT), modified conjugate gradient algorithm is devised. This algorithm is added a parameter to conjugate gradient algorithm for realizing sufficient descent property. Convergence is analyzed. Result of image reconstruction is given used Land Weber iteration algorithm, Tikhonov regularization algorithm, conjugate gradient...
We have been using advanced modeling and simulation, especially first principles methods, as a valuable tool to design microelectronic materials systems. In this presentation, several successful examples will be given to demonstrate how advanced modeling and simulation through first principles have played an important role in materials design, processing, and reliability, and have positioned us far...
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