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In this paper investigations for the non-destructive characterization of MEMS (Micro-Electro-Mechanical- Systems) are presented that can be applied in the production monitoring in early stages. Different aspects and experimental results are shown for silicon membrane structures with artificial faults. The structures were characterized by their resonant frequencies and associated mode shapes measured...
In this paper a method is described that can be applied for the non-destructive characterisation of micromechanical structures. This method can be used to inspect membranes and thin films on wafer level and is based on a combination of dynamic measurements via a laser-Doppler-vibrometer in combination with numerical simulations. First investigations are done on silicon membrane structures at production...
The market share of thin semiconductors has continuously increased in microelectronical, micromechanical as well as in the solar industries in the recent years, e.g. due to required flexibility for RFIDs or cost reduction of solar cells. However thin wafers are difficult to handle, because of the increasing flexibility and increasing sensitivity to mechanical, thermal and intrinsic loads in manufacturing...
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