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Recent years many technical papers had discussed a lot on copper wire boned devices reliability by conducting various reliability tests [1, 2]. The most common failure analysis methods used are cross section, SEM and FIB to study the IMC growth and acid decapsulation to remove the mold compound to inspect die surface [1]. Usually wire pull and ball shear test were used to evaluate the wire and ball...
Giant magnetoresistance (GMR) is a quantum mechanical magnetoresistance effect observed in thin-film structures composed of alternating ferromagnetic and non-magnetic conductive layers. Today GMR has been used in various fields including detecting DNA hybridization and pathogenic microorganism[1], screening diagnostic biomarkers[2], detecting HBV genotypes[3], and so on. NT-proBNP is an established...
Nanowires have attracted considerable interest as the nanoscale interconnects and as the moving elements of both electronic and electromechanical devices. The evaluation of nanomechanical property plays a significant role in the development of new nanowire-based devices. Recently, we are engaged in developing an easy method for nanomechanical measurement by using an in-plane-mode piezoresistive vibration...
In this paper, we successfully demonstrate ultrahigh density (> 106 cm−2) Cu-Cu interconnects of 6-µm pitch using wafer-on-wafer thermo-compression bonding. This is a significant improvement from our previous achievement of 15-µm pitch. In addition, we integrate Cu sealing frame with excellent helium leak rate to the bonded structures to promote the overall bond reliability. On top of that, temporary...
In this work, we present the fabrication method and the experimental results of a dielectrophoretic (DEP) device for particle batch separation. The curved parts of serpentine microchannel that causes performance deterioration in capillary electrophoresis (CE) due to the plug dispersion are effectively used in our design for dielectrophoretic separation. The top-and-bottom focusing electrodes are employed...
A trichromatic phosphor-free white light-emitting diode has been implemented by using adhesive bonding scheme. As 25mA and 60mA was injected into the red and blue-green LED chips at room temperature respectively, white light emission could be observed with CIE chromaticity coordinates (0.3330,0.3241), correlated color temperature Tc=5467K and optical power φe=2.223mW.
Current paper describes the testing, alignment and bonding of a PDMS-glass bonded microfluidic device used for single cell analysis. The channels were successfully tested using carboxylate modified polystyrene beads for any leakage. Polystyrene beads of 2 mum have been successfully trapped within the reservoir of the device by well known dielectrophoresis technique and the same technique will be used...
Recent progress in the development of micro-cables for very densely packed silicon pad detector modules to be used in a Compton Prostate Probe is reported. The purpose of this development is to optimize the packaging and interconnection of 1mm thick silicon sensors with their readout electronics in such a way that the assembly thickness is dominated by the sensor thickness. The sensor-chip interconnections...
This paper describes the fabrication process and device performance of CMOSFET with direct silicon bonded (DSB) substrate. This works offers the first comprehensive evaluation of source/drain engineering for DSB devices. Scanning spreading resistance microscopy (SSRM) technique reveals specific dopant profile that lateral diffusion along the bonding interface, in addition to the highly activated dopant...
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