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Recently, three-dimensional integrated circuit (3D IC) integration technology consisting of TSV and micro joints has been viewed as one of the very promising solutions to go beyond Moore's law. Typical solder joints for 3D IC stacking technique under development today has a solder volume about 1000 μm3, which is roughly 1/500 that of a conventional flip-chip solder joint with usually an 100 μm in...
The microstructure features and the IMC kinetics of Cu-Sn and Ni-Sn soldering reaction under space confinement are studied in the present study. Experimentally, Cu/Sn(10 μm)/Cu and Ni/Sn(10 μm)/Ni sandwich structures were prepared through a hot-press bonding. Sn with a thickness of 10 μm was chosen to simulate the joints in 3D IC packages employing a severe space confinement. Microstructure characterisations...
Six critical issues relating to interfacial reactions arising from space confinement in 3-D integrated-circuit (3-D IC) packaging are presented in this paper. The first issue arises from the concern that intermetallics (IMCs) may occupy a large portion of the solder joint volume. It will be demonstrated that this concern is real even for Ni under bump metallurgy (UBM) or surface finish, which reacts...
This paper presents a novel formula describing traveling body wave in fish swimming, offering an enhanced understanding of the locomotion and body shape of those fish swimming by body and/or caudal fin (BCF) movements. The formula is mainly determined by the linear density of the fish, under the constraint that the center of mass of the fish is fixed on the axis along the swimming direction. Further,...
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