The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We demonstrate 22 nm node technology compatible, fully functional 0.1 mum2 6T-SRAM cell using high-NA immersion lithography and state-of-the-art 300 mm tooling. The cell exhibits a static noise margin (SNM) of 220 mV at Vdd=0.9 V. We also present a 0.09 mum2 cell with SNM of 160 mV at Vdd=0.9 V demonstrating the scalability of the design with the same layout. This is the world's smallest 6T-SRAM cell...
In this article, in line with a research study, analysis and investigation of a new communication system are presented to reduce interfaces and save cables for mechatronic self-sustainable modules, which will result in new modular machine concepts. The DC link of inverter driven electrical drives is used as a communication medium for transmitting data to control the drive and to get the values of...
Recent years have shown the tremendous need for visual recording in consumer, telecom and security. Especially mobile phones have driven that trend to today's ultra-small cameras embedded into the handset. While the image capture IC features ever-decreasing pixel geometries and surging megapixel numbers, the readout circuitry and optical systems are now challenged to follow-up with this trend. This...
This paper reports on a novel microscanner with two degrees-of-freedom (DOF) fabricated from a shape memory alloy (SMA) thin film composite consisting of a three-layer system of Ti(Ni,Cu)/Mo/Fc(Cr,Ni). This three-layer system creates concave and convex curvatures upon heating and cooling, respectively, due to a strong change of bimorph stress mainly induced by a martensitic transformation. The resulting...
A new PCB stacking technology to improve the third dimension in system integration for miniaturized sensor systems has been presented. It is possible to use all well-known assembly technologies for subsystem-boards. With the final stacking step of these element-boards at panel level 3D high performance electronic or sensor systems can be produced effectively and with high yield. The PCB stacking technology...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.