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Recent years have shown the tremendous need for visual recording in consumer, telecom and security. Especially mobile phones have driven that trend to today's ultra-small cameras embedded into the handset. While the image capture IC features ever-decreasing pixel geometries and surging megapixel numbers, the readout circuitry and optical systems are now challenged to follow-up with this trend. This...
A new PCB stacking technology to improve the third dimension in system integration for miniaturized sensor systems has been presented. It is possible to use all well-known assembly technologies for subsystem-boards. With the final stacking step of these element-boards at panel level 3D high performance electronic or sensor systems can be produced effectively and with high yield. The PCB stacking technology...
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