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Efficiency droop remains a significant problem to be overcome if the performance of LEDs for solid state lighting is to be improved. As more cost effective substrates such as silicon wafers are used on which to grow the LED active layers, the overall output efficiency and efficiency droop at high drive currents need to be monitored and better understood. This paper investigates the droop effect at...
Low cost wafer-level chip-scale vacuum packaging (WLCSVP) imposes unique constraints on potential implementation of through-silicon vias (TSVs). A WLCSVP requires a relatively thick substrate to prevent mechanical failure. Two approaches for integrating TSVs in thick silicon wafers have been successfully demonstrated. Both approaches enable TSV formation from the backside of a device wafer and are...
A new sample-to-answer polymer lab-on-a-chip, which can perform immunoassay with minimum user intervention through on-chip reservoirs for reagents and single microchannel assay, has been designed, developed and successfully characterized as a point-of-care testing (POCT) cartridge for the detection of thyroid stimulating hormone (TSH). Users only need to drop a sample to the POCT cartridge to obtain...
A cylindrical magnetron system and a hybrid inductively coupled plasma-assisted magnetron deposition system were examined experimentally in light of their discharge characteristics with a view to stress the enhanced controllability of the hybrid system. The comparative study has shown that the hybrid magnetron the inductively coupled plasma system is a flexible, powerful, and convenient tool that...
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