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Thin conducting gold films with nanoconstriction are characterized by noise spectroscopy with and without a single 1,4-benzenedithiol (BDT) molecule between the contacts. The low frequency noise spectral density demonstrates the 1/fα type behavior with a factor, α, near to 1. It is shown, that the normalized noise spectral density is proportional to the resistance R in power 3/2 for the case without...
Carbon nano-particles are nano-sized crystalline with predominantly graphitic structure. Our recent work showed that DNA-attached Carbon Nano-Particles (DAC) can be positioned between microelectrodes in a microfluidic system to investigate its electrical properties. Dielectrophoretic based “deposition” led to a robust adhesion of various DACs with the chip substrate even after repeatedly DI water...
This paper describes the assembly of 2 nm gold nanoparticles between micro-fabricated planar electrodes by using dielectrophoresis (DEP). The optimal conditions for effectively dieletrophoretic manipulation have been established through theoretical analysis and experimental validation. In the theoretical analysis, the effect of Brownian motion was taken into consideration, as well as the electrothermal...
Recently much effort has been made in characterizing and realizing tunneling field effect transistors (TFET). Fundamental to the operation of such devices is the direct band-to-band tunneling of carriers from the n++ source to the p++ drain, which is the same current transport mechanism of Esaki Tunnel Diodes (ETD). Therefore, ETDs are an effective way to understand the potential of TFETs for high...
Biofuel cells are considered the most promising future energy source. This paper presents a bio-energy generation system based on the micro-fluidic platform which utilized enzymes as catalysts and glucose as a fuel to process the electrobiochemical energy conversion and storage in a cell. This is known as the enzymatic bio-fuel cell (EBFC). It is designed to consist of two modified gold electrodes...
IC performance and cost drive interconnect dimensions to shrink to ever-smaller sizes the RC delay becomes the dominant factor to impact IC performance. The RC delay is a function of the product of the total resistance and capacitance of the whole interconnects structure. To reduce RC delay, copper interconnects were introduced to replace aluminum. At the same time, the low K material has been widely...
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