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The radiation from a power-ground planes structure in high-speed printed circuit boards due to high switching noise current is investigated in this paper. A 2D contour integral method is used to characterize the radiation from the power-ground planes. The contour integral method can model an arbitrarily shaped power-ground planes pair more efficient than 3D numerical methods. By combining the noise...
A two-dimensional full-wave method is presented in this paper for efficient power integrity and EMI Analysis of highspeed electronic packages. The power/ground planes in electronic packages form a parallel-plate structure, which is solved by a 2D finite-different time domain (2D FDTD) method. Both the conductor loss and the substrate loss are modeled by the 2D method. Besides the parallel-plate structure,...
A system-level modeling approach, which combines the MoM (method of moments) and the SMM (scattering matrix method) has been presented for the modeling of advanced electronic packages (Oo et al., 2007). The focus of this paper is on addressing the problems of multilayered multiple via coupling and finite ground effects by the SMM method. Significant extensions of the SMM method facilitate the modeling...
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