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Hotspot cooling by heat spreader is essential to avoid reliability issues of the power electronic devices. Herein, the evaluation of the heat spreading capability of mono‐ and multi‐layer graphene using a Pt/Cu/Ti micro‐coil heater‐thermometer is reported. Monolayer graphene is grown and transferred onto the test structure which consists of micro‐coil, pads, and heat sinks. The temperature coefficient...