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TSV interposer provides a cost efficient solution way for 3D IC integration. In this paper, a TSV interposer technology is proposed for SRAM stacking. A simple fabrication process is developed for cost-sensitive application. The mushroomlike Cu/Sn bumps by copper overburden can be directly connected with other substrate, which eliminates a CMP planarization to improve the yield and reduce fabrication...
The performance and threshold voltage variability of quasi-planar bulk MOSFETs are compared against those of conventional bulk MOSFETs, via three-dimensional (3-D) device simulations with gate line-edge roughness and atomistic doping profiles, at 25 nm gate length. The nominal performance of six transistor (6-T) SRAM cells is studied via 3-D simulation of full cell structures. Compact (analytical)...
Continued increase in variability is a challenge for SRAM scaling into sub-22 nm nodes, and presents an opportunity for the introduction of alternate technologies. In this work, the performance and threshold-voltage variability of vertical SOI finFETs are compared against those of planar fully depleted (FD) SOI MOSFETs with thin buried oxide, and are presented as an alternative to planar bulk CMOS...
The performance and threshold-voltage variability of vertical SOI FinFETs are compared against those of planar fully depleted SOI MOSFETs with thin buried oxide, via three-dimensional device simulation with atomistic doping profiles and gate line-edge roughness, for the 22 nm CMOS technology node (25 nm gate length). Compact modeling is then used to estimate six-transistor SRAM cell performance metrics...
6T-SRAM cell designs for the 22 nm node are compared via full 3-dimensional cell simulation with Sentaurus (v.2008.09), to allow the benefits of advanced MOSFET structures to be accurately assessed. Segmented MOSFET (SegFET) technology provides for enhanced read stability and write-ability, as compared to conventional planar and tri-gate technologies. It also provides for improved SRAM cell yield,...
Multi-gate devices are expected to enable continued scaling beyond the 32nm node in part due to their improved gate control of the channel versus planar MOSFETs. Static random access memory (SRAM) scaling, which requires increasing design margins despite decreasing layout area, may motivate the transition to a multi-gate architecture. Tri-gate bulk devices are an attractive multi-gate option because...
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