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This paper reports on a number of extraction techniques to investigate the TSV parasitics in 3D integration/packaging, including 3D fullwave electromagnetic (EM) simulator, 3D quasi-static EM simulator, static SPICE simulator, and empirical calculations. All the TSV RLGC values extracted from the fullwave simulation are in good agreement among different approaches over the entire frequency range of...
This letter reports on techniques of full-wave extractions and analytical calculations to investigate the through-strata-via (TSV) parasitics in 3-D integration/packaging. Both methods suggest close TSV RLGC results over the entire frequency range of interest. A wideband SPICE model is generated from the TSV electromagnetic solutions with good agreement for both magnitudes and phases of return loss...
Since the conventional planar ICs encountered many physical, technological and economic bottlenecks, 3D integration by stacking and connecting function blocks in a vertical fashion is regarded as a viable approach to alleviate such bottlenecks. Through-strata-via (TSV) is one of the most attractive 3D integration solutions, which offers a massive number of short interconnects, high bandwidth, reduced...
Through-strata-via (TSV) is regarded as a critical component in 3D integration that extends Moore's Law. This paper reports on TSV crosstalk performance under high speed operations using a 3D electromagnetic field solver and a SPICE simulator in both the frequency domain and time domain. Impacts of the rise time, the TSV pitch/height, the substrate resistivity and the guarding TSV termination on crosstalk...
3D integration is expected to lead to a semiconductor industry paradigm shift due to its tremendous benefits to performance, data bandwidth, functionality, heterogeneous integration, power and cost. In this work, we consider the case where solder balls and through-strata-vias (TSVs) are paired to electrically connect stacked chips in a vertical fashion. For the given solder-TSV configurations, transient...
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