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This paper describes a millimeter-sized electret vibrational energy harvester fabricated by a MEMS-based process for power generation enhancement. To increase current generation, we developed a new “slit-and-slider” structure with horizontal arrays and vertical protrusions. This structure enables us to increase an area and to narrow a gap of energy conversion in the limited size. The structure was...
We have developed a novel methodology to design systems composed of complementary metal-oxide-semiconductor (CMOS) and microelectromechanical systems (MEMS) parts. This multiscale methodology combines bottom-up modeling and top-down design-space exploration through the following steps: 1) In bottom-up modeling, characteristics of CMOS circuits and MEMS structures are accurately simulated at the circuit...
Electrical separation-walls with a high aspect ratio are fabricated in the narrow space between mirror-drive electrodes. With these walls between adjacent channels, each MEMS mirror successfully operates with very low electrical interference.
This paper presents experimental proof of energy harvesting with MEMS-based vibrational devices. To clarify the effect of the coupling of vibration of MEMS devices and electrical field of electrets for current generation, a slit-and-slider structure was developed. This structure enables to combine the MEMS devices and electrets after their vibrational and electrical properties have been characterized...
The performance of electronic devices has been improved by increasing packaging density using advanced packaging technologies. Typical highly densified packages are SiP (System in a Package) and MCM (Multi Chip Module). These package and module structures include multiple LSI chips in them. Though conventional LSI or memory chips have been planarly aligned on a substrate, 3D-stacked chip structures...
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