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As miniaturization is the permanent pursuit of microelectronic industry, stencil printing technology for flip chip bumping has been contributing to this trend for almost half a century. Nowadays, it's still one of the lowest cost solutions to massive manufacture of IC packaging industry. To meet the requirement of further miniaturization, this paper investigated the realization of fine pitch (about...
Current techniques for nondestructive quality evaluation of solder bumps in electronic packages are either incapable of detecting solder bump cracks, or unsuitable for in-line inspection due to high cost and throughput. As an alternative, a solder bump inspection system is being developed at Georgia Tech using laser ultrasound and interferometric techniques [1]. This system uses a pulsed Nd:YAG laser...
A novel laser ultrasound and interferometer inspection system has been successfully applied to detect interconnection defects including missing, misaligned, open, and cracked solder bumps in flip chips, chip scale packages and chip capacitors. In this paper, wavelet analysis of ultrasound vibration signals is presented and compared to previous methods, including error ratio and correlation coefficient...
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