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The problems of uneven flow distribution of vapour-liquid in the parallel pipes widely exist in power boilers, steam generators, heat exchangers and boiling water reactors. The root cause of instability is that the pressure drop versus mass flow rate curve of the system shows an "N-shape" behaviour. To solve this two-phase instability, the simplest and the most effective method is to install...
With the development of electricity market fair competition becomes the most important and basic principle. Although the transmission losses account for a very small part in the full cost of the electric transactions, how to allocate the transmission losses has great effects on the special trade and the network customers. The paper proposes the analytic expression of power components distributing...
As the speed of digital systems continues to increase, digital design has entered a new realm that requires high integration and high complexity with limited dimension. Different from the parameter analysis in low frequency which mainly focuses on resistances and their effects, the coactions of resistances, inductances and capacitances are all needed to be taken into account in high frequency. This...
This paper reports the designing/simulation and experimental investigation into the Deep RIE-based micro-fabrication of through-Si-via (TSV) which acts as the vital vertical interconnect for compact 3-D system-in-package integration. An in-house developed process simulator based on cell/string evolution algorithm and physical modeling is used to explore suitable DRIE conditions for drilling vias with...
A TSV (Through Silicon Via) structure with I-shaped structure for 3D packaging is proposed in this paper. Based on the notching effect and gradient etching process of DRIB, this kind of structure can be fabricated in the existed facilities, without additional processes and equipments. According to microwave transmission line theory and by using finite element full-wave analysis tool, simulation of...
This paper proposes a bulk micromachined tunable dual-mode bandpass filter. Splitting of odd and even degenerate modes in its resonators by perturbation, is utilized for bandpass filtering. Thus, the filter, with 4% bandwidth and 17 GHz midband, requires only half resonators of conventional micromachined devices, resulting in a more compact configuration. CPW (coplanar waveguide) and CPS (coplanar...
This paper reports a bulk micromachined microwave tunable bandpass filter whose tunability is accomplished by MEMS bridges. This kind of tunable bandpass filter is based on elliptic function lowpass prototype filters. The proposed filter is constructed by the combination of a tunable lowpass filter and a highpass one which can either be tunable or not. In this way, the tunable bandpass filter can...
A microfabrication flow for through silicon via (TSV), as one of the critical and enabling technologies for three dimensional system in packaging (3D SiP), is presented in this paper. We focus on several critical processing steps for TSV fabrication, including: via micromachining; deposition of via insulation, barrier, and Cu seed layer; Cu electroplating for via-fill. Si DRIE (deep reactive ion etching)...
TSV (through silicon via ) has been widely welcomed as an enabling technology for three-dimensional integration in a package with high density. The developing of a drilling method for TSVs with tapered sections by experimental methodology can be a tedious task. The authors thus explore the possibility to simulate the process conditions effectively with an in-house developed simulator which utilize...
This paper reports a bulk micromachined microwave tunable lowpass filter with its resonator tuned by butterfly-like loading bridges on Pyrex glass. Effectively, the filter is tuned by shifting the first transmission zero, and is based on 7th order ellipse architecture, whose use in RF MEMS filters has not been reported as far as the authors know. Perturbation method is used to anticipate analytically...
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