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2.5D IC is an important transition product of 3D IC in the next generation. It has very important commercial value. However, at present 2.5D IC package process has numerous issues that need to be overcome, especially for interface delamination caused by warpage under reflow temperature. Conventionally, the material adopted for the passivation (PA) layer in 2.5D IC package is inorganic metal glass...
This paper addresses the key stress and strain characteristics issues in three-dimensional integrated circuit (3D IC) packaging, which arise due to mechanical and thermo-mechanical loading. Although 3D IC packaging is known to suffer critical issues due to the reliance on non-mature technologies, it is valued for its high performance and miniaturization, achieved through the short vertical interconnections...
This paper provides the physics of failure (PoF) analysis methodology in a three-dimensional integrated circuit (3D IC) integration based on mechanical and thermo-mechanical concepts. The majority of research on the 3D IC package has focused on the Coefficient Thermal Expansion (CTE) mismatch and heat junctions. The primary problems of CTE mismatch and heat dissipation cause failures or fatigues in...
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