Search results for: Wei‐Cheng Lin
Experimental Thermal and Fluid Science > 2014 > 55 > Complete > 187-199
Microelectronics Journal > 2014 > 45 > 4 > 449-453
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 7 > 487 - 489
Electronics Letters > 2014 > 50 > 11 > 815 - 817
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 9 > 646 - 648
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 4 > 1049 - 1055
Microelectronics Journal > 2013 > 44 > 12 > 1309-1315
Microwave and Optical Technology Letters > 56 > 1 > 77 - 83
Wireless Communications and Mobile Computing > 13 > 16 > 1464 - 1481
Nuclear Engineering and Design > 2013 > 263 > Complete > 77-86
Tetrahedron > 2013 > 69 > 38 > 8263-8268
IEEE Transactions on Electron Devices > 2013 > 60 > 8 > 2611 - 2618
Electronics Letters > 2013 > 49 > 16
Microelectronic Engineering > 2012 > 91 > Complete > 59-63