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Composite thin films consisting of multi-layered polymers and metals are widely used in integrated circuits(IC) and its packaging, and it arises intricate wafer warpage problems due to complex inner stress distribution and evolution. The wafer warpage origination and mechanism of a multi-layered polymer-metal composite thin film is identified and analyzed in this paper. Different PI/Cu composite structures...
Warpage issue of wafer level package (WLP) has caught the attention of WLP industry. This paper aims at the warpage characteristics and optimization of the WLP (consisting of silicon MEMS wafer and silicon cover wafer) with glass frit bonding. Finite-element method (FEM) was used to study the warpage and stress optimization of the Si-Si bonding WLP. Some factors which affect WLP warpage, such as CTE...
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
As a common problem in wafer lever packaging(WLP), wafer warpage caused by heat process should be carefully controlled in case of product inaccuracy or yield loss, and redistribution layer (RDL), as a key structure of WLP, is one of the major concerns that causes warpage. In this paper, a novel RDL tailored by pulsed electrodeposited nanotwinned copper (nt-Cu) was introduced into WLP. It was found...
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
Warpage issue of wafer level package (WLP) has caught the attention of WLP industry. This paper aims at the warpage characteristics and optimization of the WLP (consisting of silicon MEMS wafer and silicon cover wafer) with glass frit bonding. Finite-element method (FEM) was used to study the warpage and stress optimization of the Si-Si bonding WLP. Some factors which affect WLP warpage, such as CTE...
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