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The 3D-DRAM stacked over the processor is a vibrant technique in order to overcome the memory wall as well as the bandwidth wall problems. We considered a system with two DRAM dies over a single processor die. We assumed the decoupling capacitors to be placed on each DRAM die and connected to the power distribution TSV pairs, where the TSVs pass through the DRAM stack. In this paper we proposed a...
This paper presents a method for the prediction of temperature distribution in a walking beam furnace chamber and slabs, this method is realized by coupling the steady thermal process in the furnace chamber and transient heat conduction process in the slab, these two processes exchange heat flux and temperature conditions on the surface of slabs. The movement of the slab is taken into account by changing...
Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip...
On-chip power supply noise has become a bottleneck in 3D ICs as scaling of the supply network impedance has not been kept up with increasing device densities and operating currents with each technology node due to limited wire resources. In this paper we proposed an efficient and accurate model to estimate peak-to-peak switching noise, caused by simultaneous switching of logic loads along a vertical...
How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.
Extensive transient simulations for on-chip power delivery networks are required to analyze power delivery fluctuations caused by dynamic IR and Ldi/dt drops. Speed and memory has become a bottleneck for simulation of power distribution networks in modern VLSI design where clock frequency is of the order of GHz. The traditional SPICE based tools are very slow and consume a lot of memory during simulation...
On-chip power distribution network model for simultaneous switching of 3D ICs stacked through TSVs to choose TSV pattern, maximum number of chips in a stack and location of the decoupling capacitor for early design trade-offs.
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